Details
Chip-Scale Power Supplies for DC-Link and Grid Applications
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68,47 € |
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| Verlag: | Springer |
| Format: | |
| Veröffentl.: | 25.06.2024 |
| ISBN/EAN: | 9783031608209 |
| Sprache: | englisch |
Dieses eBook enthält ein Wasserzeichen.
Beschreibungen
<p>This book is a comprehensive single-source on the design of chip-scale high-voltage power supplies for low-power DC-link and grid applications. It is written in handbook style with systematic guidelines and includes implementation examples. The authors cover the full range, from technology fundamentals to circuit implementation details. The book includes guidelines for the application-specific selection of the converter topology, design guidelines for the inductive components, and a detailed description of low-power optimized control approaches and subcircuits. The authors also include guidelines for the selection and design of high-voltage on-chip power switches and for the reduction of parasitic effects such as capacitive losses.</p>
<p>Introduction.- Motivation and Challenges.- High Voltage DC DC Converters.- AC DC Conversion.- Low Power Subcircuits for High Voltage Designs.- Circuit Design in SOI.- Conclusion and Outlook.</p>
<p>Christoph Rindfleisch received the B.Eng. degree in electrical engineering from the Cooperative State University Baden Württemberg, Mosbach, Germany, in 2011 and the M.Sc. degree in power and microelectronics from Reutlingen University, Reutlingen, Germany, in 2014. He received the Ph.D. degree (Summa Cum Laude) in electrical engineering from Leibniz University Hannover, Germany, in 2023. For his Ph.D. research, he was working on highly integrated high-voltage power converters. In 2023, he joined Infineon Technologies in Dresden as an analog mixed-signal design engineer, focusing on circuit design for chip-scale power converters. Dr. Rindfleisch serves as a reviewer for the IEEE Journal of Solid-State Circuits.</p>
<p>Bernhard Wicht has 20+ years of experience in analog and power management IC design. He received the Dipl.-Ing. degree from TU Dresden in 1996 and the Ph.D. degree (Summa Cum Laude) from TU Munich in 2002. Between 2003 and 2010, he was with Texas Instruments in Germany, responsible for the design of automotive power management ICs. He was a professor at Reutlingen University and he is currently the head of the Chair for Mixed-Signal IC Design at Leibniz University Hannover, Germany. His research interest includes IC design with focus on power management, gate drivers and high-voltage ICs. Dr. Wicht was co-recipient of the 2015 ESSCIRC Best Paper Award and of the 2019 First Prize Paper Award of the IEEE Journal of Emerging and Selected Topics in Power Electronics. In 2018, he received the faculty award for excellent teaching at his university. He invented seventeen patents with several more pending. Dr. Wicht is a member of the Technical Program Committee of ISSCC, where he is currently the chair of the Power Management subcommittee. He was a Guest Editor of the IEEE Journal of Solid-State Circuits-Special Issue of 2019 ISSCC and a Distinguished Lecturer of the IEEE Solid-State Circuits Society in 2020-2021.</p>
<p>Bernhard Wicht has 20+ years of experience in analog and power management IC design. He received the Dipl.-Ing. degree from TU Dresden in 1996 and the Ph.D. degree (Summa Cum Laude) from TU Munich in 2002. Between 2003 and 2010, he was with Texas Instruments in Germany, responsible for the design of automotive power management ICs. He was a professor at Reutlingen University and he is currently the head of the Chair for Mixed-Signal IC Design at Leibniz University Hannover, Germany. His research interest includes IC design with focus on power management, gate drivers and high-voltage ICs. Dr. Wicht was co-recipient of the 2015 ESSCIRC Best Paper Award and of the 2019 First Prize Paper Award of the IEEE Journal of Emerging and Selected Topics in Power Electronics. In 2018, he received the faculty award for excellent teaching at his university. He invented seventeen patents with several more pending. Dr. Wicht is a member of the Technical Program Committee of ISSCC, where he is currently the chair of the Power Management subcommittee. He was a Guest Editor of the IEEE Journal of Solid-State Circuits-Special Issue of 2019 ISSCC and a Distinguished Lecturer of the IEEE Solid-State Circuits Society in 2020-2021.</p>
<p>This book is a comprehensive single-source on the design of chip-scale high-voltage power supplies for low-power DC-link and grid applications. It is written in handbook style with systematic guidelines and includes implementation examples. The authors cover the full range, from technology fundamentals to circuit implementation details. The book includes guidelines for the application-specific selection of the converter topology, design guidelines for the inductive components, and a detailed description of low-power optimized control approaches and subcircuits. The authors also include guidelines for the selection and design of high-voltage on-chip power switches and for the reduction of parasitic effects such as capacitive losses.</p>
<ul>
<li>Provides a single source for the design of chip-scale HV power supplies for low-power DC-link and grid applications;</li>
<li>Demonstrates different converter implementations, depending on the requirements and the available technology options;</li>
<li>Presents control approaches and innovations on subcircuit level that enable an efficient HV power conversion;</li>
<li>An active zero-crossing buffer is presented that shrinks the required buffer capacitor in the AC interface;</li>
<li>Describes guidelines for the selection of HV on-chip power switches and the reduction of parasitic effects and losses.</li>
</ul>
<ul>
<li>Provides a single source for the design of chip-scale HV power supplies for low-power DC-link and grid applications;</li>
<li>Demonstrates different converter implementations, depending on the requirements and the available technology options;</li>
<li>Presents control approaches and innovations on subcircuit level that enable an efficient HV power conversion;</li>
<li>An active zero-crossing buffer is presented that shrinks the required buffer capacitor in the AC interface;</li>
<li>Describes guidelines for the selection of HV on-chip power switches and the reduction of parasitic effects and losses.</li>
</ul>
Provides a single source for the design of chip-scale HV power supplies for low-power DC-link and grid applications Demonstrates different converter implementations, depending on the requirements and the available technology options Presents control approaches and innovations on subcircuit level that enable an efficient HV power conversion
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